So, you’re curious to know what’s inside your iPhone 3G, but dread actually unscrewing the thing and taking a look for yourself? Well, luckily for you, TechOnline has exposed the nitty gritty details of the iPhone’s insides.
Bloggers at TechOnline examined the iPhone's technical specifications and measured everything from the phone’s motherboard to its 3G capabilities. Read below for the highlights.
- TriQuint, developers of low-cost, high-performance circuits, provided the iPhone’s three power-amplifier (PA) front-end modules, which increases the iPhone’s signal up to 10 Mbits/s.
- Infineon gave birth to the iPhone’s amazing signal strength through its UMTS transceiver and the baseband processor, which is actually a two-chip package. The first chip caters to GSM/GPRS/EDGE waveforms and the second is the WCDMA/HSDPA accelerator for 3G signal.
- The basebands support memory comes from Numonyx and includes 16 MBytes of NOR flash and 8 Mbytes of pseudo-SRAM.
- Also part of the signal family is a Skyworks 824- to 915-MHz quad-band GSM/EDGE amplifier module, as used in the OG iPhone.
- Power management of the iPhone 3G is split between two ICs: Infineon’s SMARTi Power 3i and system-level power control manufactured by NXP.
- Linear Technology takes care of the iPhone’s battery charging and general USB power control.
- The built-in GPS is handled by another Infineon chip, called the “Hammerhead II”. TechOnline mentions that this time, the iPhone is accurate within meters. The Hammerhead manages to avoid large errors in urban areas.
- Apple stuck with Samsung for it’s main applications processor, supported by 128 Mbytes of DDR SDRAM
- Toshiba produces the 8GByte and 16GByte NAND flash memory.
- The SST25VF080B 8-Mbit serial flash chip from SST rounds out the iPhone 3G's memory support.
- The single chip Wi-Fi is offered by Marvell and is accompanied by a Bluetooth chip made by CSR.
- The iPhone 3G’s audio codec received an upgrade from Wolfson.
- The iPhone’s touchscreen uses just a revised Broadcom chip and a Texas Instruments line driver, compared to the OG iPhone's three chips.
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Links:
[1] http://www.maclife.com/user/fion
[2] http://www.maclife.com/article/blogs/dissecting_iphone_3g
[3] http://www.techonline.com/product/underthehood/209000013?pgno=2
[4] http://www.triquint.com/
[5] http://www.infineon.com/
[6] http://www.numonyx.com/
[7] http://www.skyworksinc.com/
[8] http://www.nxp.com/
[9] http://www.linear.com/
[10] http://www.infineon.com/cms/en/product/applications/wireless-communication/gps/hammerhead-2.html
[11] http://www.samsung.com/
[12] http://www.toshiba.com/
[13] http://www.sst.com/
[14] http://www.marvell.com/
[15] http://www.google.com/url?q=/finance?client=ob&q=NYSE:CSR&sa=X&oi=stock&ct=title&usg=AFQjCNFWGRUXS2mqCackPaTB-3StCflU-Q
[16] http://www.wolfsonmicro.com/
[17] http://www.broadcom.com/
[18] http://www.ti.com/
[19] http://www.maclife.com/article/iphone/iphone_3g_teardown
